Wafer carrier, wafer level packaging, and MEMS

Available For Purchase

at (CLOSED) 2017 Spring Catalog

Available For Purchase at (CLOSED) 2017 Spring Catalog
ID 004
Seller Gredmann Taiwan Ltd.
Sector Semiconductors
Assets 33 Assets: 20 US Patents, 13 Foreign Patents
US Patents 6359718 7002725 7008821 7045463 7258806 7361284 7505118 7533564 7582511 7585417 7598125 7605970 7622334 7987588 8030111 8114699 8310328 8318511 8453318 8456724
Other Patents TW480346; TWI222534; TWI229377; TWI234261; TWI242255; TWI256940; TWI275416; TWI278045; TWI284966; TWI305474; TWI305998; TWI363414; TWI376739

Lot Summary

With a 2001 priority date, the disclosed portfolio describes systems and methods for wafer level packaging and fabricating cap structures, forming a wafer backside interconnecting wire, Waferlevel packaging cutting method capable of protecting contact pads, an integration manufacturing process for MEMS devices, for making a planar coil, fabricating a diaphragm of a capacitive microphone device. 

Due Diligence

Patent NumberFile History
6359718
7002725fh7002725.pdf
7008821fh7008821.pdf
7045463fh7045463.pdf
7258806fh7258806.pdf
7361284fh7361284.pdf
7505118fh7505118.pdf
7533564fh7533564.pdf
7582511fh7582511.pdf
7585417fh7585417.pdf
7598125fh7598125.pdf
7605970fh7605970.pdf
7622334fh7622334.pdf
7987588fh7987588.pdf
8030111fh8030111.pdf
8114699fh8114699.pdf
8310328fh8310328.pdf
8318511fh8318511.pdf
8453318fh8453318.pdf
8456724fh8456724.pdf